Laser direct writing of copper on ... - SPIE Digital Library- laser direct writing of copper circuits on flexible substrates for electronic devices ,Laser induced copper deposition from solid copper formate precursor films has been studied on polyimide, FR4 and Al<SUB>2</SUB>O<SUB>3</SUB> substrates. Unlike most work reported in the literatures, we used 532 nm Nd:YAG laser beam instead of CW Ar<SUP>+</SUP> laser for the process. A writing speed of 10 mm/s was achieved for deposition of micron-thick copper lines with a typical electrical ... Laser Direct-Write of Embedded Electronic Components and Circuitscomplete embedded circuit in a plastic substrate requiring low processing temperatures (≤ 100 °C). 2. LASER DIRECT-WRITE Laser direct-write (LDW) is a general term that encompasses modification, subtraction and addition processes that can create patterns of materials directly on substrates without the need for lithography or masks [3].
These films were also fabricated into flexible copper clad laminates and patch antenna operated in sub-6G band. The antenna exhibited a return loss of −32.8 dB and a gain of 7.04 dBi. The flexible substrates show great potential and satisfy large-scale production demand in high TC flexible circuit board materials field.
The invention provides a method for directly writing an oxidation-resistant copper microstructure by femtosecond laser and copper ion ink, wherein the method is used for directly writing a copper microstructure on a copper ion film by the femtosecond laser to manufacture a microelectronic device and comprises the following steps: (a) providing copper ion ink, wherein the copper ion ink ...
Laser Direct Writing (including Laser Induced Transfer, Laser Sintering and Laser Patterning) of functional materials has emerged as a reliable, high resolution and versatile fabrication tool for flexible electronics, sensors and optoelectronic components. In this paper we highlight the newest trends of Laser Direct Write manufacturing for the development of a variety of components with ...
After a 1500 time bending test, the resistance only increased 5.2%. With laser-induced in-situ synthesis, sintering, and simultaneous patterning of silver nanoparticles, this technology is promising for the facile fabrication of conducting electronic devices on flexible substrates.
Waterproof sensor has been successfully fabricated by laser direct writing. A 405 nm laser was used to direct writing silver nanoparticles conductive circuits inside PDMS flexible substrate for sensor fabrication. Silver nanoparticles conductive circuits were simultaneously synthesized and patterned inside the PDMS film.
Advanced Techniques: Laser Direct-Write Patterning and Laser Ablation MicroConnex helped to pioneer laser direct-write processes for rapid fabrication of fine-scale flex circuits and MEMS devices down to a 10 μm feature size. For advanced products, research projects, and limited production runs, our laser direct-write and laser ablation services are unmatched in the industry, enabling a …
tive copper circuits were fabricated by laser direct writing. After transferred on to PDMS, the flexible sensor based on conductive copper ci rcuits showed high sensitivity and mechanical robust...
Laser induced copper deposition from solid copper formate precursor films has been studied on polyimide, FR4 and Al<SUB>2</SUB>O<SUB>3</SUB> substrates. Unlike most work reported in the literatures, we used 532 nm Nd:YAG laser beam instead of CW Ar<SUP>+</SUP> laser for the process. A writing speed of 10 mm/s was achieved for deposition of micron-thick copper lines with a typical electrical ...
In this work, copper circuits were fabricated on flexible polyimide (PI) substrates by high repetition rate femtosecond laser-induced selective local reduction of copper oxide nanoparticles (CuO NPs). The effects of laser pulse energy and laser scanning velocity on the quality of the copper circuit were studied. By optimizing laser processing parameters, we prepared a Cu circuit of a line ...
In this study, we developed a method for the fabrication of electrically conductive copper patterns of arbitrary topology and films on dielectric substrates, by improved laser-induced synthesis from deep eutectic solvents. A significant increase in the ...
Request PDF | Laser direct writing of waterproof sensors inside flexible substrates for wearable electronics | The preparation of stable, reliable and multifunctional sensors requires constant ...
In this work, laser direct writing is used to fabricate copper/graphene composite electrodes on a flexible substrate in one step. This direct writing process with a low power laser can reduce ...
The flexible substrate is coated with photosensitive resist. The resist coated substrate is positioned in the LDI exposing unit. LDI digitally exposes the desired pattern. The resist is developed and the unwanted resist is washed away. The copper pattern exposed by removed resist is chemically removed i.e. etched. The resist is stripped off.
One example is a 600-MHz oscillator designed, modeled, fabricated and tested at the NRL on a flexible polyimide substrate using four different electronic materials (see Fig. 3). On bees and beyond. Currently, the process of direct-writing electronic materials on living biological substrates or specimens remains relatively unexplored territory.
In this study, we developed a method for the fabrication of electrically conductive copper patterns of arbitrary topology and films on dielectric substrates, by improved laser-induced synthesis from deep eutectic solvents. A significant increase in the processing efficiency was achieved by acceptor substrate pretreatment, with the laser-induced microplasma technique, using auxiliary glass ...
Stretchable electronic sensing devices are defining the path toward wearable electronics. High-performance flexible strain sensors attached on clothing or human skin are required for potential applications in the entertainment, health monitoring, and medical care sectors. In this work, conducting copper electrodes were fabricated on polydimethylsiloxane as sensitive stretchable microsensors by ...
In this study, we developed a method for the fabrication of electrically conductive copper patterns of arbitrary topology and films on dielectric substrates, by improved laser-induced synthesis from deep eutectic solvents. A significant increase in the processing efficiency was achieved by acceptor substrate pretreatment, with the laser-induced microplasma technique, using auxiliary glass ...
Laser Direct Writing (including Laser Induced Transfer, Laser Sintering and Laser Patterning) of functional materials has emerged as a reliable, high resolution and versatile fabrication tool for flexible electronics, sensors and optoelectronic components.
Portable and wearable devices have attracted wide research attention due to their intimate relations with human daily life. As basic structures in the devices, the preparation of high-conductive metallic circuits or micro-circuits on flexible substrates should be facile, cost-effective, and easily integrated with other electronic units. In this work, high-conductive carbon/Ni composite ...
Flexible electrodes have attracted much attention in consumer electronic applications. In this work, laser direct writing is used to fabricate copper/graphene composite electrodes on a flexible substrate in one step. This direct writing process with a low power laser can reduce copper ions
By laser-induced direct reduction and transfer printing, microsensors based on conducting copper circuits was fabricated on polydimethylsiloxane or polyimide as cheap and sensitive devices. A specific electrical resistivity of 240 μΩ cm of Cu circuit was successfully achieved in an electrode of about 40 μm in thickness.
Laser Direct Writing (including Laser Induced Transfer, Laser Sintering and Laser Patterning) of functional materials has emerged as a reliable, high resolution and versatile fabrication tool for flexible electronics, sensors and optoelectronic components. In this paper we highlight the newest trends of Laser Direct Write manufacturing for the development of a variety of components with ...
In this study, a novel scribing–seeding–plating (SSP) process for the fabrication of copper circuits with a strong adhesion strength of 39.68 N cm−1 and a high conductivity of 4.69 × 107 S m−1 (about 82.33% of bulk copper) onto flexible sandpaper substrates was developed. Specifically, a simple 450 nm blue l
A printed circuit board ( PCB) or printed wiring board ( PWB) is a laminated sandwich structure of conductive and insulating layers. PCBs have two complementary functions. The first is to affix electronic components in designated locations on the outer layers by means of soldering. The second is to provide reliable electrical connections (and ...
